Purchase Office 2010 Step of 10 from sand to chip

Vista House (www.vista123.com): 10 actions of: from sand to chip - see The best way to Make the processor

may be mentioned the central processing unit (CPU) will be the modern Social speedy operation from the power source, in any digital gadget may be found about the microchip of the figure, but it was also dismissed, that the processor, this thing is no technical content material, but a pile of sand within the aggregate only. Isn't it? Intel these days introduced a substantial quantity of show information, showing in detail the chip from your sand to the entire process, basic or not see at a glance.
simply, the processor could be approximately divided to the sand inside the manufacturing method of raw materials (quartz), silicon ingots,Purchase Office 2010, wafers, lithography (offset printing), etching, ion implantation, steel deposition, metal layer, interconnect, wafer testing and cutting, the core package, course testing, packaging marketplace, and a large number of other actions, and within every action with the process and consists of extra detail.


below to merge graphic, step by step examine:



sand: Silicon will be the 2nd abundant factor in the crust , and following the sand oxygen (especially quartz) contain up to 25% with the silicon to silicon dioxide (SiO2) in the form, which is the basis for that semiconductor production business.


silicon melting: twelve inches / 300 mm wafer level, the very same beneath. Obtained by multi-step purification for silicon semiconductor manufacturing quality, generic digital grade silicon (EGS),Office Pro 2010 Key, an common of each million silicon atoms in the most 1 impurity atom. This diagram shows how the purification through the melting of silicon crystals are large, the resulting ingot is (Ingot).


monocrystalline silicon ingots: the general simple cylindrical, weighing about 100 kg of silicon purity of 99.9999%.

the first phase of a photo





silicon ingot cutting: a single horizontal cut into circular silicon , that is, we commonly say that the wafer (Wafer). From the way, this will be the next round wafer know why,Purchase Office 2007, proper?


Wafer: Following cutting out the wafers following polishing will become almost best, even when the mirror surface. In fact, Intel itself doesn't create the wafers, but from a third celebration semiconductor companies to buy items there, and then use their very own manufacturing line for additional processing, like the now mainstream 45nm HKMG (high-K metal gate.) It is really worth mentioning that, Intel company was founded using the wafer size is just two inches / 50 mm.

the 2nd phase of the photograph





photoresist (Photograph Resist): proven in blue is poured inside the wafer during rotation to the photoresist liquid, comparable to the kind of conventional film creation. Shop photoresist wafer rotation makes it possible for quite skinny, particularly flat.


lithography: photoresist layer followed by mask (Mask) was exposed to ultraviolet (UV) beneath, turn into soluble, similar towards the chemical reactions that happen in the course of Press the mechanical film camera modifications the moment the shutter. Pre-designed mask on the printed circuit pattern, by means of which shines ultraviolet photoresist layer, each layer will form a microprocessor circuit style. In general, the circuit pattern around the wafer from the mask pattern is one-fourth.


lithography: the resulting nano-sized transistors in to the 50-200 stage. A wafer could be minimize out of numerous processors, however the see from here down to one, and show the right way to make transistors and other components. The equivalent of switching transistor to manage the current path. Now the transistor is so little that a needle are going to be able to place down about thirty million.
third phase of a photograph





photoresist dissolution: the exposure to ultraviolet lithography lithography underneath glue is dissolved away, leaving the patterns and cleared around the very same mask.


etching: using chemical substance is dissolved from exposed parts with the wafer, though the remaining photoresist protects the part really should not be etched.


eliminate photoresist: etching is completed, resist the mission declared completed, all apparent immediately after the created circuit pattern might be witnessed.

the fourth stage a picture





resist: resist doused once more (blue part), then lithography, and wash exposed components from the remaining photoresist is employed to safeguard that component of ion implantation isn't material.


ion implantation (Ion Implantation): inside a vacuum program, by means of the accelerated use to ion irradiation doping atoms (injection) of sound material, which was injected within the Regional formation of the special injection layer, and alter the conductivity of silicon location. Following the electrical subject acceleration, the velocity of ion implantation may be additional than 30 million km per hour.


photoresist elimination: ion implantation is completed, the photoresist was removed, and into the region (green) has also been doped into different atoms. Be aware that this time the green and different from before.

fifth stage a photo





transistors in location: At this point, the transistor happens to be basically accomplished. Within the insulation material (magenta) around the 3 holes etched, and filled up with copper to interconnect with other transistors.


Plating: plating a layer of copper sulfate around the wafer, the copper ion deposition for the transistor. Copper ions from the cathode (anode) to damaging (cathode).


copper layer: Immediately after plating, copper ions deposited about the wafer surface, forming a skinny copper layer.

sixth stage a picture



polishing: polishing off the excessive copper, which will be the polished wafer surface.


metal layers: the transistor level, the mixture from the 6 transistors, about 500 nm. Complex formed among the various transistor interconnect metal layer, according to the certain layout of the various wants of the corresponding processor performance. Chip look irregular smooth surface, but in reality may well contain 20 multi-storey complicated circuits may be noticed soon after amplification circuit network is really complicated,Office 2010 Standard, multi-layer formed like a futuristic highway technique.

seventh stage a picture





wafer testing: the kernel degree, about ten mm / 0.5 inch . The image is actually a partial wafers, being the first functional check, using the reference circuit pattern, and each and every chip had been in contrast.


wafer slices (Slicing): wafer-level, 300 mm / 12 inches. The wafers into pieces, each piece can be a processor core (Die).


discarded faulty kernel: wafer degree. The test defects discovered during a kernel abandoned, leaving intact for the following move.

eighth stage of photo





single kernel: kernel stage. Wafer was reduce from just one core, exactly where the show is the core of Core i7.


Package deal: package-level, twenty mm / one inch. Substrate (substrate), the kernel, the heat sink stacked with each other to type the way in which we see the processor. Substrate (green) is equivalent to a base, and for that processor core supplies electrical and mechanical interface together with the Pc easily interact with other elements with the technique. Warmth sink (silver) is accountable for cooling the core.


Processor: At this time the processor has to become total (this is a Core i7). The world's most clear space created products are actually one of the most complicated is the outcome of a huge selection of steps could be achieved,Office 2007 Pro Plus Key, here only present a few of the crucial steps.

the ninth stage of a picture





degree test: the last check, can identify each and every 1 The important thing attributes with the processor, such as optimum frequency, power consumption, warmth, etc., and determine the level of the processor, for instance, created probably the most high-end Core i7-975 Excessive, or even the low-end Core i7-920.


Packing: According to the amount of the check outcomes will likely be the very same degree of processors delivered collectively.


retail packaging: manufacturing, testing completed batch delivered to the OEM processor or producer, or around the packaging box to enter the retail marketplace. Core i7 is the situation right here.

the tenth stage of a picture

text / drive residence

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